Advanced Technology
1.Up to 64 layer processing technology, the minimum trace and space is 2.5 / 2.5mil, the highest ratio of board thickness and hole diameter is 16:1.
2. Long and short gold finger processing technology and high-density trace's precision control to meet the design requirements of photoelectric communication products.
3. High-precision back-drilling technology to reduce the equivalent series inductance of vias and in case to meet the product's integrity requirements of signal transmission;
4. Advanced metal-based and ultra-thick copper manufacturing process to meet the high heat dissipation requirements of power products.
5. High-precision mechanical and laser depth control technology to achieve multi-level step groove product's structure and meet the different levels of assembly requirements.
6. The mature mixed pressure process realizes the mixing of FR-4 and high-frequency materials, and saves the material cost for customers under the premise of achieving the high-frequency performance of the products.
7. Advanced Anti-CAF process technology greatly improves the reliability and service life of PCB products.
8. Advanced buried capacitor and buried resistor technology greatly improve the performance of PCB products.
9. Advanced inner layer exposed technology meets the information transmission requirements of high frequency circuits.
High-quality Raw Materials
1. PCB substrate materials: Select the top brands in the industry: Shengyi, ROGERS, ARLON, TACONIC, 3M, Omega, etc.
2. Auxiliary materials: Rohm and Haas electroplating syrup, Hitachi dry film, Taiyo ink, Noda resin, etc.
PCB capability
| Items | Mass production | Mass production | Prototype |
| Layers | 32L | 6L | 40L |
| Board type | Rigid PCB | FPC | Rigid&flex |
| HDI Stackup | 4+n+4 | N/A | Any layer |
| Max. Board Thickness | 10mm(394mil) | 0.30mm | 14mm(551mil) |
| Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| Max. Copper Thickness | 6oz | 12oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm(4mil) | 0.050mm(2mil) | |
| Max. Size (Finish Size) | Line-card | 850mm*570mm | 1000mm*600mm |
| Backplane | 1250mm*570mm | 1320mm*600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 14:1 | 18:1 |
| Backplane | 16:1 | 28:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG | ||
PCBA capability
| Process | Item | Mass production capability | |
| SMT | Printing | Max PCB size | 900*600mm² |
| Max PCB weight | 8kg | ||
| Solder paste printing tolerance | ±25μm(6σ) | ||
| System repeat calibration tolerance | ±10μm(6σ) | ||
| Scraper pressure detection | pressure closed-loop control system | ||
| SPI | Detect Min BGA PAD to PAD distance | 100μm | |
| x-axis and Y-axis tolerance | 0.5μm | ||
| False Rate | ≤0.1% | ||
| Mount | Component size | 0.3*0.15 mm²--200*125 mm² | |
| Component max height | 25.4mm | ||
| Populate Max component weight | 100g | ||
| BGA/CSP Min PAD spacing, and Min PAD diameter | 0.30mm,0.15mm | ||
| Populate tolerance | ±22μm(3σ),±0.05°(3σ) | ||
| PCB board size | 50*50 mm²-850*560 mm² | ||
| PCB thickness | 0.3mm--6mm | ||
| Max PCB weight | 6kg | ||
| Populate Max components type | 500 | ||
| AOI | Detect Min components | 01005 | |
| Detect false type | Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball | ||
| Foot warping detection | 3D Detection function | ||
| Reflow | Temperature Accuracy | ±1ºC | |
| Welding protection | nitrogen protection;(remaining oxygen<3000ppm) | ||
| Nitrogen Control | Nitrogen closed-loop control system,±200ppm | ||
| 3D X-Ray | Magnification | Geometric Magnification;:2000 times;System Magnification:12000times | |
| Resolution | 1μm /nm | ||
| Rotation Angle &Slanting Perspective | Any ±45°+360°rotation | ||
| DIP | Preelaboration | Automatic forming technology | Component Automatic forming |
| DIP | DIP technology | Automatic Insertion machine | |
| Wave soldering | Wave soldering type | Ordinary wave soldering | |
| Inclination angle of transport guide rail | 4--7° | ||
| Temperature accuracy | ±3ºC | ||
| Soldering protection | nitrogen protection | ||
| Non-welding pressure contact technology | Max PCB board size | 800*600mm² | |
| Press down height accuracy | ±0.02mm | ||
| Pressure Range | 0-50KN | ||
| Pressure Accuracy | Standard value:±2% | ||
| Hold time | 0-9.999S | ||
| Conformal coating technology | Max PCB board size | 500*475*6mm | |
| Max PCB board weight | 5kg | ||
| Min Nozzle size | 2mm | ||
| Other characteristic | Conformal coating pressure Programmable control | ||
| ICT test | test level | Device level test,Test hardware connection status. | |
| Test point | >4096 | ||
| Test content | Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test. | ||
| Assembly and test | Production type | TouchPad | Mass production |
| TWS | Mass production | ||
| Baby Camera | Mass production | ||
| Gaming controller | Mass production | ||
| Life Watch | Mass production | ||
| FT test | test level | PCB board system level test.Test System function status. | |
| Temperature cycling test | Temperature range | -60ºC--125ºC | |
| Rise/lower temperature rate | >10ºC/min | ||
| Temperature tolerance | ≤2ºC | ||
| Other Reliability test | burn-in test,Drop test, vibration test , Abrasion test ,Key life test. | ||
