4L test instrument PCB board 2oz immersion tin surface

           Shenzhen LvMeiJinYu Electronics Co.,Ltd     Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% p

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           Shenzhen LvMeiJinYu Electronics Co.,Ltd

     Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc.. 

     Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.

     Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.


Different Product 
4L Test Instrument PCB Board 2oz Immersion Tin Surfacement

1.  Process capacity
 
Process Capability And Checking Parameters(Hard Board)
NO ITEMTechnical Capabilities
1Layers2-58L ,68L for samples
2Max.Board Size1200*610mm
48"*24"
3Finished Board Thickness0.2mm--10.0mm,17.5mm for samples
0.008"--0.4"
4Finished Copper Thickness17um-420um
0.5OZ--12OZ
5Min.Trace Width/Space0.075mm/0.065mm
0.003"/0.0026"
6Min.Hole Size0.15mm
0.006"
7Hole Dim. Tolerance(PTH)±0.05mm
±0.002"
8Hole Dim.Tolerance(NPTH)±0.05mm
±0.002"
9Drill Location Tolerance±0.05mm
±0.002"
10V-Cut Degrees20-90 ºC
20DEG-90DEG 
11Min.V-Cut PCB Thickness0.4mm
0.016"
12N/C Routing Tolerance±0.1mm
±0.004"
13Min.Blind/Buried Via0.15mm
0.06"
14Plug Hole Size0.2mm--0.6mm
0.008"--0.024"
15Min.BGA PAD0.2mm
0.008"
16MaterialsFR4,Aluminium,High Tg,Halogen-free,Rogers,ShengYi,KB
17Surface FinishLF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F
18Warp & Twist≤0.75%
19Electrical Testing50--300V
20Solderability Testing245±5ºC,3sec Wetting area least95%
21Thermal Cycling Testing288±5ºC,10sec,3cycles 
22Ionic Contamination TestingPb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23Soldmask Adhesion Testing260ºC+/-5, 10S,3times
 
Process Capability - Technical Parameters(FPC)
ContentCommonSpecialSurface treatmentThickness
Minimum line width0.07mm0.05mmElectroplated nickel goldNi:3-9um;Au:0.03-0.1um
Minimum line spacing0.07mm0.05mm
Minimum Drilling apertureΦ 0.15mmΦ 0.1mm
Aperture Tolerance±0.1mm±0.05mmChemical immersion goldNi:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel)610mm*1200mm(Exposure limit)250mm*35mm(only develop test samples)
Maximum imposition size (double panel)610mm*1200mm(Exposure limit)250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)610*1650mmElectroplated hard goldNi:2-9um;Au:0.1-0.3um
Finished board impedance tolerance±10%Electroplated pure tinSn:3-7um
Maximum production layer12L
Thickness To Diameter Ratio2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm)Anti-oxidation 
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m²16000 m²
 
Material
Substrate MaterialPI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive MediumCopper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
AdhesiveEpoxy resin, Acrylic, Adhesion
Solder Mask / Protective FilmPI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue3M467,3M468,3M9077,TESA8853...
Reinforcement TypePI,FR4,PET,Steel,Aluminum...
        
2. Lead Time
4L Test Instrument PCB Board 2oz Immersion Tin Surfacement





3. Stack-Up

4L Test Instrument PCB Board 2oz Immersion Tin Surfacement



4.Product Type

4L Test Instrument PCB Board 2oz Immersion Tin Surfacement


If you have PCB project pls send your Gerber files and PCB specification,we will reply to you ASAP. Thank you!
 

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