8-layer high Tg thick copper immersion gold plate-red

Advanced Technology1.Up to 64 layer processing technology, the minimum trace and space is 2.5 / 2.5mil, the highest  ratio of board thickness and hole diameter is 16:1.2. Long and short gold finger processing technology and high-density trace\'s precision control to meet the design requirements of photoelectric communicatio

Featured Products

Advanced Technology
1.Up to 64 layer processing technology, the minimum trace and space is 2.5 / 2.5mil, the highest  ratio of board thickness and hole diameter is 16:1.

2. Long and short gold finger processing technology and high-density trace's precision control to meet the design requirements of photoelectric communication products.

3. High-precision back-drilling technology to reduce the equivalent series inductance of vias and in case to meet the product's integrity requirements of signal transmission;

4. Advanced metal-based and ultra-thick copper manufacturing process to meet the high heat dissipation requirements of power products.

5. High-precision mechanical and laser depth control technology to achieve multi-level step groove product's structure and meet the different levels of assembly requirements.


6. The mature mixed pressure process realizes the mixing of FR-4 and high-frequency materials, and saves the material cost for customers under the premise of achieving the high-frequency performance of the products.

7. Advanced Anti-CAF process technology greatly improves the reliability and service life of PCB products.

8. Advanced buried capacitor and buried resistor technology greatly improve the performance of PCB products.

9. Advanced inner layer exposed technology meets the information transmission requirements of high frequency circuits.


High-quality Raw Materials
1. PCB substrate materials: Select the top brands in the industry: Shengyi, ROGERS, ARLON, TACONIC, 3M, Omega, etc.
8-Layer High Tg Thick Copper Immersion Gold Board - Red
2. Auxiliary materials: Rohm and Haas electroplating syrup, Hitachi dry film, Taiyo ink, Noda resin, etc.
8-Layer High Tg Thick Copper Immersion Gold Board - Red


PCB capability
ItemsMass productionMass productionPrototype
Layers32L6L40L
Board typeRigid PCBFPCRigid&flex
HDI Stackup4+n+4N/AAny layer
Max. Board Thickness10mm(394mil)0.30mm14mm(551mil)
Min. WidthInner  Layer2.2mil/2.2mil2.0mil/2.0mil
Outer Layer2.5/2.5mil2.2/2.2mil
RegistrationSame  Core±25um±20um
Layer to Layer±5mil±4mil
Max. Copper Thickness6oz12oz
Min. Drill Hole DlameterMechanical≥0.15mm(6mil)≥0.1mm(4mil)
Laser0.1mm(4mil)0.050mm(2mil)
Max. Size (Finish Size)Line-card850mm*570mm1000mm*600mm
Backplane1250mm*570mm1320mm*600mm
Aspect Ratio (Finish Hole)Line-card14:118:1
Backplane16:128:1
MaterialFR4EM827, 370HR, S1000-2, IT180A, EM825, IT158,  S1000 / S1155, R1566W, EM285, TU862HF
High SpeedMegtron6, Megtron4, Megtron7,TU872SLK,  FR408HR,N4000-13 Series,MW4000,MW2000,TU933
High FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835,  CLTE, Genclad, RF35, FastRise27
OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega  , ZBC2000,
Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion  Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG

PCBA capability

ProcessItemMass production capability
SMTPrintingMax PCB size900*600mm²
Max PCB weight8kg
Solder paste printing tolerance±25μm(6σ)
System repeat calibration tolerance±10μm(6σ)
Scraper pressure detectionpressure closed-loop control system 
SPIDetect Min BGA PAD to PAD distance100μm
x-axis and  Y-axis tolerance0.5μm
False Rate ≤0.1%
Mount Component size0.3*0.15 mm²--200*125 mm²
Component max height25.4mm
Populate Max component weight100g
BGA/CSP Min PAD spacing, and Min  PAD diameter0.30mm,0.15mm
Populate tolerance±22μm(3σ),±0.05°(3σ)
PCB board size 50*50 mm²-850*560 mm²
PCB thickness0.3mm--6mm
Max PCB weight6kg
Populate Max components type500
AOIDetect Min components01005
Detect false typeIncorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
Foot warping detection3D Detection function
ReflowTemperature Accuracy±1ºC
Welding protectionnitrogen protection;(remaining oxygen<3000ppm)
Nitrogen ControlNitrogen closed-loop control system,±200ppm
3D X-RayMagnificationGeometric Magnification;:2000 times;System Magnification:12000times
Resolution1μm /nm
Rotation Angle &Slanting PerspectiveAny ±45°+360°rotation
DIPPreelaborationAutomatic forming technologyComponent Automatic forming
DIPDIP technologyAutomatic Insertion machine
Wave solderingWave soldering typeOrdinary wave soldering
Inclination angle of transport guide rail4--7°
Temperature accuracy±3ºC
Soldering protectionnitrogen protection
Non-welding pressure contact technologyMax PCB board size800*600mm²
Press down height accuracy±0.02mm
Pressure Range0-50KN
Pressure AccuracyStandard value:±2%
Hold time0-9.999S
Conformal coating technologyMax PCB board size500*475*6mm
Max PCB board weight5kg
Min Nozzle size2mm
Other characteristicConformal coating pressure Programmable control 
ICT testtest levelDevice level test,Test hardware connection status.
Test point>4096
Test contentContact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
Assembly and testProduction typeTouchPadMass production
TWSMass production
Baby CameraMass production
Gaming controllerMass production
Life WatchMass production
FT testtest levelPCB board system level test.Test System function status.
Temperature cycling testTemperature range-60ºC--125ºC
Rise/lower temperature rate>10ºC/min
Temperature tolerance≤2ºC
Other Reliability testburn-in test,Drop test, vibration test , Abrasion test ,Key life test.

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