Aluminum nitride thermal ceramics with high thermal conductivity

Insulator Ceramic Plate Aluminium Nitride Ceramic Product Description   The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemi

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Insulator Ceramic Plate Aluminium Nitride Ceramic 

Product Description
   The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests.

Alumina Nitride Thermal Ceramic with High Thermal Conductivity

Specifications:
1.High thermal conductivity
2.High flexural strength, high temperature
2.Good electrical insulation


Alumina Nitride Thermal Ceramic with High Thermal Conductivity




Product  Performance:
High thermal conductivity, high flexural strength, high temperature
Good electrical insulation
Low dielectric constant and loss

 Alumina Nitride Thermal Ceramic with High Thermal Conductivity
 
 
Material Properties:
 
Material Properties of Aluminum Nitride Substrate/Wafer
Property ContentProperty Index
Density(g/cm3)3.335
Resistance to Thermal ShockNo Cracks
Thermal conductivity(30°C, W/m.k)≥170
Linear expansion coefficient
(/°C, 5°C/min, 20-300°C)
2.805×10-6
Flexural strength (MPa)382.7
Volume Resistivity (Ω.cm)1.4×1014
Dielectric constant(1MHz)8.56
Chemical Durability (mg/cm2)0.97
Dielectric strength (KV/mm)18.45
Surface roughness Ra(μm)0.3~0.5
Camber (length‰)≤2‰
Appearance/ ColorDense/ Dark Gray

 
Note: The general characteristics of the materials described above were derived from laboratory test performed by Innovacera from time on sample quantities. Actual characteristics of production lots may vary. 
 Alumina Nitride Thermal Ceramic with High Thermal Conductivity
 
 
Applications:

RF/Microwave Components
Power Modulus
Power Transformers
High Power LED package
Laser Diode Sub-mounts
LED Chip Sub-mount
Microelectronic Packages
Transistors

 Alumina Nitride Thermal Ceramic with High Thermal Conductivity

Laser processing service:
Through laser machine scribing, cutting, and drilling, we can process AlN substrate with high accuracy and absolute consistency upon customers'request.
 
Polishing processing service:
Our AlN substrate can be polished(single and double polish) by the advanced machine which imported from abroad. Ceramic substrate surface roughness can reach to 0.03-0.05um without porous after being polished. It is perfectly suitable for the device application of small spec, high precision , wiring density and good stability.
   
As a professional company in advanced ceramic industries, HIGHBORN is supplying high quality and high precision ceramic components for clients from worldwide. Our ceramic products are widely used in various fields of automotive, metallurgy, machinery, electronic & electrical, food, chemical, medical and so on. With experienced engineers and talented workers, we are able to evaluate projects and drawings properly, make valuable suggestion, supply satisfying products. Our materials including:

 
- Aluminium Oxide ( 95% 96% 99% 99.5% 99.7% Al2O3 )
- Zirconium Oxide ( Yttria stabilized ZrO2 )
- Silicon Nitride ( Gas pressure sintered & Hot pressed Si3N4 )
- Silicon Carbide (Reactive sintered,  Pressureless sintered & Recrystallization SiC)
- Aluminum Nitride
- Machinable Glass Ceramic
 
   Aiming at building long term cooperation relationship with our clients, we set our motto as "Quality First". Far now, our products have been exported to North Amirica, East Europe, West Europe, East Asia, Southeast Asia and get good reputation from our client.


Company introduction:

Alumina Nitride Thermal Ceramic with High Thermal Conductivity
Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd. Was founded in 2010, a total investment of more than 1000000 RMB. Jia RiFeng Tai is a professional committed to the domestic and foreign electronic thermal insulation materials of high-tech enterprises.

Our Main Products: Thermal conductive filler material, like thermal gap pad, insulator silicone sheet, insulator silicone sleeve, ACF conductive film, thermal silicone heating, thermal double-sided tape, thermal graphite, thermal silicone encapsulants, thermal grease / paste, alumina ceramic, Aln ceramic, zirconia ceramic, Sic ceramic, NFC Ferrite sheet, EMI absorber sheet, thermal phase change material, silicone rubber (Fujipoly), Bergquist thermal conductive material K4, K6, K10 insulation gap pad.


Exhibition :

Alumina Nitride Thermal Ceramic with High Thermal Conductivity

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We can make many specifications according to your request !
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