Security DVR 8 layer PCB Tg170 immersion gold full turnkey PCB&PCBA

           Shenzhen LuMeiJinYu Electronics Co.,Ltd  Shenzhen lumei Jinyu Electronics Co., Ltd. was founded in 2011, is a professional production of double-sided,multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meter

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           Shenzhen LuMeiJinYu Electronics Co.,Ltd

  Shenzhen lumei Jinyu Electronics Co., Ltd. was founded in 2011, is a professional production of double-sided,multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meters, more than 2000 employees and a monthly production capacity of 1.5 million square feet. The main products are high-precision through-hole board, , multi-layer circuit board, flexible circuit board, Rigid and flexible board and PCB Assembly, while providing SMT supporting services to customers.

 Lvmay strives to be a win-win partner with customers, advocates quality first, and provides customers with reliable one-stop interconnection solutions. Our products are widely used in military units, scientific research and development, quantum satellites, industrial control, medical equipment, aerospace, drones, unmanned vehicles, high-speed rail trains, new energy batteries, power electronics, automobile LED lights, security, and other high-tech industries, providing customers with all aspects of product services, and have been unanimously recognized by many customers at home and abroad.


PCBS From Lvmay


Security DVR 8layers PCB Tg170 Immersion Gold Full Turn Key PCB&PCBA


1.  Process Capability
 
Technical Capability
ItemsMassSample
layers2-68L2-120L
Max. Board Thickness10mm(394mil)14mm(551mil)
Min. Width/SpaceInner Layer50/50um40/40um
out layer65/65um50/50um
RegistrationSame Core±25um±20um
Layer to Layer±4.5mil±4mil
Heavy Copper6oz30oz
Min. Drill Hole
Diameter
Mechanical0.15mm(6mil)0.1mm(4mil)
Laser0.1-0.35mm0.05-0.35mm
()       Max. Size
(Finish Size)
Line-card850mmX570mm1000mmX570mm
Backplane1250mmX570mm1320mmX570mm
()    Aspect Ratio
(Finish Hole)
Line-card20:127:1
Backplane25:132:1
Raw Material/Lead free/Halogon freeEM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W,EM285,TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF
High SpeedMegtron4, TU872SLK, FR408HR,N4000-13Series, S7439C,TU863+,Megtron6, MW2000, IT968,EM891,Megtron7,MW4000,TU933,DS7409DVN,IT988GSE
High FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002
OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,ST115
Surface Finish,,,OSP,,,/,OSP,                          HASL,ENIG,Immersion Tin,OSP,Immersion Silver,Gold finger,Electroplating Hard Gold/Soft Gold,Selective OSP, ENEPIG
Gold fingers(gold thickness)40U"60U"
/Radio
Frequency/Micro Strip
 Precision
Line Width±0.8mil/±0.5mil±0.6mil/±0.5mil
Line Length±1.5mil/±1.2mil±1.2mil/±1mil
Metal baseStructurePost-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U)
HDI High Density Interconnect CapabilityStructureMax Layer count( any layer)18LMax Layer count( any layer)18L/20L
Min Blind via size (mm)0.1mm/0.075mm0.075mm/0.075mm
Min. Width/Space(out layer)65/65um 50/50um50/50um 40/40um
Rigid&Flex StructureBook, Air-gap, Fly-tail, Unsymmetrical, Semi-flex
Flex Layer Count max.Max Layer count( any layer)12LMax Layer count( any layer)14L
Impedance Tolerance+/-10%+/-8%
Flex Core Thk (Exclude copper) (um)2012.5
Flex outline to Pattern tolerance(mm)+/-0.1+/-0.05
Finished BD thk (mm)0.075 ~0.250.075 ~0.25
Raw materialDupontAP, AK, Panasonic RF-777, ITEQ IF, LCP, Tk
FPC1L, 2L1L: length 5000 meters, 2: length 46 meters(2oz),OSP1L: length 5000meters,2L: length 46meters(2oz),OSP
Roadmap 2019/2020
Products20192020
/Mass/Sample/Mass/Sample
BackplaneLayers68L/120L68L/120L
Max. Size
(Finish Size)
1250mmX570mm/1320mmX570mm1250mmX570mm/1320mmX570mm
Max. Board Thickness10mm/14mm10mm/14mm
(0.31mm)                         Aspect Ratio
(Finish Holes 0.31mm)
25/3225/35
(0.36mm)                        Aspect Ratio
(Finish Holes 0.36mm)
27/3327/33
Line-CardLayers32L/36L36L/36L
/Min. Width/Space(out layer)3mil/3mil 2.5mil/2.5mil3mil/3mil  2.5mil/2.5mil
/Min. Width/Space(inner layer)2.2mil/2.2mil   2mil/2mil2.2mil/2.2mil   2mil/2mil
(0.20mm)                        Aspect Ratio
(Finish Holes 0.20mm)
20/2522/25
(0.25mm)                        Aspect Ratio
(Finish Holes  0.25mm)
21/2724/27
Impedance Tolerance±7%/±5%±5%/±5%

        
2. Lead Time

Security DVR 8layers PCB Tg170 Immersion Gold Full Turn Key PCB&PCBA


3. Stack-Up

Security DVR 8layers PCB Tg170 Immersion Gold Full Turn Key PCB&PCBA


Security DVR 8layers PCB Tg170 Immersion Gold Full Turn Key PCB&PCBA



4.Product Type

Security DVR 8layers PCB Tg170 Immersion Gold Full Turn Key PCB&PCBA



Hi,If you have any PCB requirements please send your Gerber files and PCB specification, we will reply and quoted for you ASAP. Thank you& best regards!
 

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